Many electronic components fitted together in a compact system
Typical components used in electronic designs that require heat dissipation
Background
The increasing
Heat sinks are used to dissipate the heat. The efficiency of heat sinks is dependent on the thermal conductivity and interfacial thermal resistance (arising from the mismatch of non-surface flatness and surface roughness) of the thermal interface materials.
Thermal Interface Materials (TIMs) ideally have high thermal conductivity and strong deformability and are classified as: thermal greases; elastomeric thermal pads and s
Filler-type TIMs (pastes, epoxies, adhesives, etc) represent the majority of the global market – They are low cost, easy to apply and give
The average range of thermal conductance of these solutions is 1 – 4W/mK. However, high-specification silicone-based TIMs can achieve high thermal conductivities. SIGNIFICANT is differentiated from existing silicone-based solutions in being silicone-free and therefore will not “bleed” and is differentiated from existing silicone-free solutions through having greater thermal conductivity up to 15W/mK as well as being easier to process.